Our double and multilayer facility was established in 2002, since then there had been enormous upgrades and expansions to meet market demands. Further refinements from R&D allowed us to make PCBs up to 12 layers.

Below are some highlights of our advanced processes:

• Mulitlayer lamination
• 5 Fully automatic plating lines
• Horizontal spray solder mask system
• Wet & Dry film
• Fully automatic ENIG line
• Leadfree Hot air solder levelling
• OSP coating with optional chemical withstanding 4 times solder reflow
• Ionic cleaning
• CNC V-cut
• Immersion Sn
• Immersion Ag

Contact us for more information.